Antonio Herrera's profile

Package Stress Simulation and Analysis

For this project an apparatus which could simulate package stress in pressure transducers was desired. In order to produce valuable data the process would have to be highly repeatable. The apparatus would also have to be capable of measuring minute voltage change (micro-volt range). To accomplish this the unit below was designed and fabricated. This unit is fully automated through the use of LabView as well as all data acquisition.
Package Stress Test Apparatus
Package Stress Test Apparatus Exploded View
In order to register the micro-volt voltage differential change a prototype Instrumentation Amplifier circuit was designed and fabricated
Testing prototype Instrumentation Amplifier circuit
Prototype circuit with organized wiring and additional reference voltage circuit for calculating actual voltage gain
Final circuit integrated on proto-board with labeled headers 
Sensor Housing Exploded View
Motor Housing
Motor Housing
Motor Housing Exploded View
Rail System Exploded View
Lead Screw Assembly
Lead Screw Assembly Exploded View
Stepper Driver Housing
Stepper Driver Housing Exploded View
LabView Front Panel Control 
LabView Program
Package Stress Simulation and Analysis
Published:

Package Stress Simulation and Analysis

An apparatus designed to simulate package stress in sensors.

Published: