There are many different methods of bonding microscopic systems, but each has a disadvantage of only  working with certain systems. In this paper, an epoxy applying method is described that allows flexibility between systems. This method uses a micro-pipette to dispense the epoxy to any desired location and was designed and tested for the microassmbly project at hand but can be extended to other projects.

The problem at hand is to bond a silicon piece into a slot in a die. The pipette containing epoxy is held by an adjustable structure on top of a three degree of freedom (DOF) stage. The epoxy dispenser stage allows the tip of the pipette to be moved to the slot so that epoxy can be dispensed at that location. Two tested methods involve applying the epoxy before and after the piece is inserted into the die. Both methods are finalized by curing with the use a powerful ultraviolet light emitting diode.

The current system is controlled telerobotically but is set up to be extended into an automated control system.