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high temperature wear resistant ceramic adhesives

performance features:
☆   It's consist of modified toughening heat resistant resin and the special curing agent
☆  Aging resistant,high temperature resistant,good toughness.
☆  Can cure at room temperature,can also heat for curing.
☆  The highest working temperature is 240℃,when it is used as the repair agent.The highest working temperature is 220℃,when it is used as the structural bonding.
 
product usage:
With high bonding strength and good toughness,suitable for the bonding of metal,ceramic,cement and glass.Used in the bonding of wear resistant ceramic chip under 220℃ working condition,also used in the bonding and repairing of machine part under high temperature working condition
 
How to use:
1.  Surface treatment:Grinding or sand blasting to clean up the dust,greasy dirt and rust on the surface of adherend,finally clean it by cleaning agent and dry it by airing
2.  Configure adhesive:According to the mass ratio A:B=2:1,make A and B two component mix uniformly,when the temperature is low in winter,can preheat the A component first.
3.  Using adhesive:Make the configured adhesive be coating on the adherend surface uniformly,double spread will get the better bonding effect.
4.  Curing:Initial curing for 2 hours at room temperature,full curing for 24 hours,heat it up to the temperature of 80℃ and keep this temperature for 2 hours,then do the post curing,in this way,can get the higher strength(≥23MPa).When the temperature is below 15℃,the curing speed of the adhesive layers is slow,the curing is not complete,need heating it up to the temperature of 60~80℃ and keeping this temperature for 2 hours after the adhesive layers initial curing(Bake it with the iodine tungsten lamp or heat it with hair dryer etc. heating measures)
high temperature wear resistant ceramic adhesives
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high temperature wear resistant ceramic adhesives

We produce and export various wear resistant coatings,wear and corrosion resistant coating,crusher special backing adhesives,wear resistant ceram Read More

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