I worked with the CAMJ as an undergraduate research assistant (URA) during a school term. My research project was to determine proper property, boundary conditions and physics settings to model and simulate the contacts between the ball & pad and ball & capillary in an ultrasonic ball bonding process. I developed a simple model to solve the nonlinear problem and determine the correct settings for modeling the contact.
Based on the result of my URA work, I initiated a research project to develop a finite element model to simulate a ball bonding process. For this project I was awarded a course credit with the highest grade of 99%.
semiconductor and electronic packaging industry introduces new chip and package
designs with a fast pace. One of the main challenges with these new designs
(chip/IC) is their behavior during the wire bonding process. One of the main
concerns is the mechanical damage of the underpad layers while achieving a
strong bond. Currently, experimental means are the primary characterization
method to validate any new designs. However, the process which involves
fabricating a new design and testing it is too expensive and time consuming.
approach to address this problem is using finite element (FE) means to
characterize an optimum bonding process for different types of chips. Such a
characterization would help to modify the chips’ structure to achieve good
mechanical integrity. Although the bonding mechanism has not been perfectly
understood and solved yet but some of its physical mechanisms can be described
by FE models. Some work has been done in this field; however, there is still a lot more to be done.
My research involved the effects of interfacial gap on the mechanics of thermosonic ball bonding. I used ABAQUS for my research.